MLX90641 110 FOV Thermal Camera IR Array Breakout

The 7Semi MLX90641 Thermal Camera Sensor Array Breakout incorporates a fully calibrated 16x12 pixel thermal infrared array, utilizing an industry-standard digital interface. Comprising 192 FIR pixels, the MLX90641 integrates an ambient sensor to gauge the chip's ambient temperature and a supply sensor for VDD measurement.

Employing the I2C protocol, the device supports the FM+ mode with a clock frequency of up to 1MHz and operates exclusively as a slave on the bus. Both SDA and SCL ports exhibit 5V tolerance, allowing direct connection of the sensor to a 5V I2C network.

• 110x75 Degree FOV
• 3.3/5V supply voltage
• I2C compatible digital interface
• Noise Equivalent Temperature Difference (NETD) 0.1K @4Hz refresh rate
• Programmable refresh rate 0.5Hz ~ 64Hz
• Current consumption ~ 12mA
• Operating temperature -40C ~ 125C
• Target temperature -40C ~ 300C

The MLX90641 110 FOV Thermal Camera IR Array Breakout is a powerful and versatile device for capturing and analyzing thermal images. It boasts an impressive 110x75 degree field of view, making it ideal for a wide range of applications.

The module is designed to be powered by a 3.3V or 5V supply voltage, and communicates with a microcontroller or other device through an I2C-compatible digital interface. This makes it easy to integrate into a wide range of systems, including robotics, automation, and Internet of Things (IoT) devices.

The MLX90641 110 FOV Thermal Camera IR Array Breakout features an advanced IR thermal sensor that can capture images at a resolution of 16 x 12 pixels. This allows it to detect even small temperature differences, making it an essential tool for applications such as building inspections, industrial monitoring, and medical imaging.

The MLX90641 110 FOV Thermal Camera IR Array Breakout is a high-performance device that offers unparalleled versatility and ease of use. Its advanced features and compatibility with a wide range of systems make it an essential tool for anyone working with thermal imaging applications.

• MLX90641-Datasheet-Melexis
• MLX90641Breakout 3D Step File

 MLX90641 110FOV Far Infrared Thermal Camera Breakout Dimensions

Evelta MLX90641 and MLX90640 Thermal Camera Breakout Comparison Table

High operating temperature far infrared (FIR) thermal sensor array

How field of view for infrared temperature sensors is determined

An IR Thermal Camera Breakout is a device that allows users to capture and analyze thermal images and video in real-time. It consists of an infrared thermal sensor and an accompanying microcontroller that processes the data and converts it into a visual image.

The IR Thermal Camera Breakout is typically connected to a computer or other device via USB or I2C interface, and can be powered by a 3.3V or 5V power supply. Its small size and ease of use make it a popular choice for applications such as building inspections, industrial maintenance, and medical imaging. The module can capture images and video in a range of temperatures, typically from -40C to 300C or higher, depending on the specific model. It also features high resolution and sensitivity, allowing users to detect even small temperature differences.

An IR Thermal Camera Breakout is a powerful tool for capturing and analyzing thermal data in a wide range of applications. Its real-time capabilities and ability to detect temperature differences make it an essential component in industries such as manufacturing, construction, and healthcare.